Issued Patents 2004
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831370 | Method of using foamed insulators in three dimensional multichip structures | — | 2004-12-14 |
| 6815826 | Alignment for buried structures formed by surface transformation of empty spaces in solid state materials | Joseph E. Geusic | 2004-11-09 |
| 6812571 | Low capacitance wiring layout and method for making same | — | 2004-11-02 |
| 6790702 | Three-dimensional multichip module | — | 2004-09-14 |
| 6784550 | Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication | John H. Givens | 2004-08-31 |
| 6780721 | Low dielectric constant shallow trench isolation | — | 2004-08-24 |
| 6781192 | Low dielectric constant shallow trench isolation | — | 2004-08-24 |
| 6774035 | Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication | John H. Givens | 2004-08-10 |
| 6770537 | Low dielectric constant shallow trench isolation | — | 2004-08-03 |
| 6756653 | Low dielectric constant shallow trench isolation | — | 2004-06-29 |
| 6747347 | Multi-chip electronic package and cooling system | Jerome M. Eldridge | 2004-06-08 |
| 6743716 | Structures and methods to enhance copper metallization | — | 2004-06-01 |
| 6740392 | Surface barriers for copper and silver interconnects produced by a damascene process | — | 2004-05-25 |
| 6737723 | Low dielectric constant shallow trench isolation | — | 2004-05-18 |
| 6734562 | Integrated circuit device structure including foamed polymeric material | — | 2004-05-11 |
| 6717191 | Aluminum-beryllium alloys for air bridges | — | 2004-04-06 |
| 6713861 | Method of removing free halogen from a halogenated polymer insulating layer of a semiconductor device and resulting semiconductor device | — | 2004-03-30 |
| 6714445 | Three terminal magnetic random access memory | — | 2004-03-30 |
| 6713875 | Barrier layer associated with a conductor layer in damascene structures | — | 2004-03-30 |
| 6709968 | Microelectronic device with package with conductive elements and associated method of manufacture | Jerome M. Eldridge | 2004-03-23 |
| 6696746 | Buried conductors | Wendell P. Noble | 2004-02-24 |
| 6686654 | Multiple chip stack structure and cooling system | Jerome M. Eldridge | 2004-02-03 |
| 6677209 | Low dielectric constant STI with SOI devices | — | 2004-01-13 |