Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6740983 | Method for ball grind array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2004-05-25 |
| 6740984 | Ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2004-05-25 |
| 6693363 | Ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2004-02-17 |
| 6674175 | Ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2004-01-06 |