Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835599 | Method for fabricating semiconductor component with multi layered leadframe | Lee Choon Kuan, Lee Wang Lai | 2004-12-28 |
| 6784525 | Semiconductor component having multi layered leadframe | Lee Choon Kuan, Lee Wang Lai | 2004-08-31 |
| 6781248 | Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged | Lee Kian Chai, Jason Pittam | 2004-08-24 |