Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790708 | Encapsulation process using a partial slot cover and a package formed by the process | — | 2004-09-14 |
| 6734372 | Gate area relief strip for a molded I/C package | Stephen James, Richard W. Wensel | 2004-05-11 |
| 6690086 | Apparatus and method for reducing interposer compression during molding process | Stephen James | 2004-02-10 |