Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6806119 | Method of balanced coefficient of thermal expansion for flip chip ball grid array | Kumar Nagarajan, Shirish Shah | 2004-10-19 |
| 6673708 | Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill | Ivor G. Barber | 2004-01-06 |