Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6803257 | Printed circuit board with a heat dissipation element, method for manufacturing the printed circuit board, and package comprising the printed circuit board | Yong-Il Kim | 2004-10-12 |
| 6740352 | Method for forming bonding pads | Yong-Il Kim | 2004-05-25 |
| 6706564 | Method for fabricating semiconductor package and semiconductor package | Yong-Il Kim, Yu-Seock Yang | 2004-03-16 |