Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6720262 | Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst | Hyung Sang Park, Ji-Hwa Lee | 2004-04-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6720262 | Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst | Hyung Sang Park, Ji-Hwa Lee | 2004-04-13 |