Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825065 | Method for optical module packaging of flip chip bonding | Yong Sung EOM | 2004-11-30 |
| 6707161 | Optical module package of flip chip bonding | Yong Sung EOM | 2004-03-16 |
JM
Jong Tae Moon
Overall (2004): #57,631 of 270,089Top 25%
2
Patents 2004