Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821131 | IC socket for a fine pitch IC package | Takahiro Ishibashi, Yuji Nakamura, Shuuji Kunioka | 2004-11-23 |
| 6806312 | Thermoplastic resin composition | Masahiro Sasagawa, Toshikazu Hoshina | 2004-10-19 |
| 6797776 | Thermoplastic resin composition | Toshikazu Hoshina | 2004-09-28 |
| 6780498 | Silicon-based composition, low dielectric constant film, semiconductor device, and method for producing low dielectric constant film | Yoshihiro Nakata, Iwao Sugiura, Ei Yano | 2004-08-24 |
| 6727515 | Insulation film forming material, insulation film, method for forming the insulation film, and semiconductor device | Yoshihiro Nakata, Iwao Sugiura, Ei Yano | 2004-04-27 |
| 6702609 | IC socket contact medium having uniform contact force | Yuji Nakamura | 2004-03-09 |
| 6692841 | Joined structure of dissimilar metallic materials | Takahiko Shindo, Yoshiyasu Itoh | 2004-02-17 |
| 6693250 | Hybrid gas insulation switchgear apparatus | Kozo Matsushita, Hiroshi Furuta, Kenji Arai, Osamu Nakano, Kazutoshi Ogata | 2004-02-17 |