Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815255 | Semiconductor device and manufacturing method thereof | Yukiko Nakaoka, Kazuhiko Matsumura, Hideyuki Kaneko, Hiroaki Fujimoto | 2004-11-09 |
| 6764879 | Semiconductor wafer, semiconductor device, and method for manufacturing the same | Hiroaki Fujimoto | 2004-07-20 |
| 6677674 | Semiconductor package having two chips internally connected together with bump electrodes and both chips externally connected to a lead frame with bond wires | — | 2004-01-13 |