Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6797537 | Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers | Angel Pepe | 2004-09-28 |
| 6784547 | Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers | Angel Pepe | 2004-08-31 |
| 6734370 | Multilayer modules with flexible substrates | Angel Pepe, Volkan Ozguz, Andrew Camien | 2004-05-11 |
| 6717061 | Stacking of multilayer modules | Angel Pepe, Volkan Ozguz, Andrew Camien | 2004-04-06 |