Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6817854 | Mold with compensating base | Michael J. Hundt | 2004-11-16 |
| 6815262 | Apparatus and method for attaching an integrated circuit sensor to a substrate | Michael J. Hundt | 2004-11-09 |
| 6686227 | Method and system for exposed die molding for integrated circuit packaging | Michael J. Hundt | 2004-02-03 |