SC

Suchet P. Chai

TI Teledyne Industries: 1 patents #5 of 18Top 30%
📍 San Jose, CA: #938 of 2,805 inventorsTop 35%
🗺 California: #8,555 of 28,370 inventorsTop 35%
Overall (2004): #109,013 of 270,089Top 45%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6828663 Method of packaging a device with a lead frame, and an apparatus formed therefrom Tong-Yu Chen 2004-12-07