Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6723620 | Power semiconductor die attach process using conductive adhesive film | — | 2004-04-20 |
| 6717260 | Clip-type lead frame for source mounted die | Tim Sammon, Rachel Anderson | 2004-04-06 |