Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6713366 | Method of thinning a wafer utilizing a laminated reinforcing layer over the device side | Yew Cheong, Eng Chiang Gan, Mun Leong Loke | 2004-03-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6713366 | Method of thinning a wafer utilizing a laminated reinforcing layer over the device side | Yew Cheong, Eng Chiang Gan, Mun Leong Loke | 2004-03-30 |