Issued Patents 2004
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818155 | Attaching components to a printed circuit card | George Hsieh, Norman J. Armendariz, David V. Spaulding | 2004-11-16 |
| 6803527 | Circuit board with via through surface mount device contact | Bryce Horine | 2004-10-12 |
| 6797085 | Metallurgically enhanced heat sink | Prateek Dujari, Bin Lian, Damion Searls | 2004-09-28 |
| 6793503 | Ganged land grid array socket contacts for improved power delivery | Weston Roth, Damion Searls | 2004-09-21 |
| 6793505 | Ganged land grid array socket contacts for improved power delivery | Weston Roth, Damion Searls | 2004-09-21 |
| 6774310 | Surface mount connector lead | Prateek Dujari, Bin Lian, Damion Searls | 2004-08-10 |
| 6752204 | Iodine-containing thermal interface material | Prateek Dujari, Bin Lian, Damion Searls | 2004-06-22 |
| 6730860 | Electronic assembly and a method of constructing an electronic assembly | Damion Searls, James Jackson | 2004-05-04 |
| 6682802 | Selective PCB stiffening with preferentially oriented fibers | George Hsieh, Scott Dixon | 2004-01-27 |
| 6672370 | Apparatus and method for passive phase change thermal management | Damion Searls, David Pullen | 2004-01-06 |