Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6734544 | Integrated circuit package | Soupin Yan | 2004-05-11 |
| 6715663 | Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method | Kuljeet Singh | 2004-04-06 |
| 6686659 | Selectable decoupling capacitors for integrated circuit and methods of use | — | 2004-02-03 |