Issued Patents 2004
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6820163 | Buffering data transfer between a chipset and memory modules | Randy M. Bonella, John B. Halbert, Jim M. Dodd, Chung Lam | 2004-11-16 |
| 6771515 | Systems having modules with on die terminations | Hing Y. To | 2004-08-03 |
| 6747483 | Differential memory interface system | Hing Y. To | 2004-06-08 |
| 6724082 | Systems having modules with selectable on die terminations | Hing Y. To, Michael W. Leddige | 2004-04-20 |
| 6717823 | Systems having modules with buffer chips | Hing To | 2004-04-06 |
| 6711640 | Split delay transmission line | Michael W. Leddige | 2004-03-23 |
| 6711027 | Modules having paths of different impedances | Hing“Thomas” Y. To | 2004-03-23 |
| 6708243 | Computer assembly with stub traces coupled to vias to add capacitance at the vias | Michael W. Leddige | 2004-03-16 |
| 6700457 | Impedance compensation for circuit board breakout region | Steven Stahlberg, David Shykind | 2004-03-02 |
| 6686762 | Memory module using DRAM package to match channel impedance | Michael W. Leddige | 2004-02-03 |
| 6674648 | Termination cards and systems therefore | Bryce Horine, Hing To | 2004-01-06 |
| 6674649 | Systems having modules sharing on module terminations | Hing To | 2004-01-06 |