Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6737745 | Method for relieving bond stress in an under-bond-pad resistor | William J. Gross, Jung-Yueh Chang | 2004-05-18 |
| 6734093 | Method for placing active circuits beneath active bonding pads | William J. Gross, Jung-Yueh Chang | 2004-05-11 |