Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6749760 | Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead | Tzeun-luh Huang, Dawn L. Scovell, Keith Willis | 2004-06-15 |
| 6683383 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Patrick M. Paluda, Rajan Naik | 2004-01-27 |