Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6794282 | Three layer aluminum deposition process for high aspect ratio CL contacts | Werner Robl, Rajeev Malik, Mihel Seitz | 2004-09-21 |
| 6720212 | Method of eliminating back-end rerouting in ball grid array packaging | Werner Robl, Axel Brintzinger, Gerald Friese | 2004-04-13 |