Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787242 | Methods of using adhesion enhancing layers and microelectronic integrated modules including adhesion enhancing layers | Rainer Muller, Klaus Heckmann, Friederike Bauer | 2004-09-07 |