Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6767818 | Method for forming electrically conductive bumps and devices formed | Shyh-Ming Chang, Tai-Hong Chen, Yu-Te HSIEH, Chun-Ming Huang, Ching-Yun Chang +1 more | 2004-07-27 |