Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821625 | Thermal spreader using thermal conduits | Richard C. Chu, Michael J. Ellsworth, Jr. | 2004-11-23 |
| 6820684 | Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader | Richard C. Chu, Micheal J. Ellsworth, Jr. | 2004-11-23 |
| 6819563 | Method and system for cooling electronics racks using pre-cooled air | Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt | 2004-11-16 |
| 6804966 | Thermal dissipation assembly employing thermoelectric module with multiple arrays of thermoelectric elements of different densities | Richard C. Chu, Michael J. Ellsworth, Jr. | 2004-10-19 |
| 6775137 | Method and apparatus for combined air and liquid cooling of stacked electronics components | Richard C. Chu, Michael J. Ellsworth, Jr., Edward F. Furey, Roger R. Schmidt | 2004-08-10 |
| 6767766 | Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication | Richard C. Chu, Michael J. Ellsworth, Jr. | 2004-07-27 |
| 6714412 | Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use | Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt | 2004-03-30 |
| 6705089 | Two stage cooling system employing thermoelectric modules | Richard C. Chu, Michael J. Ellsworth, Jr. | 2004-03-16 |
| 6674642 | Liquid-to-air cooling system for portable electronic and computer devices | Richard C. Chu, Michael J. Ellsworth, Jr. | 2004-01-06 |