Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812141 | Recessed metal lines for protective enclosure in integrated circuits | Michael C. Gaidis, Joachim Nuetzel, Walter Glashauser, Eugene J. O'Sullivan, Stephen L. Brown +2 more | 2004-11-02 |
| 6743642 | Bilayer CMP process to improve surface roughness of magnetic stack in MRAM technology | John P. Hummel, Kia-Seng Low, Mahadevaiyer Krishnan | 2004-06-01 |
| 6686296 | Nitrogen-based highly polymerizing plasma process for etching of organic materials in semiconductor manufacturing | Peter D. Hoh, Richard Wise, Wendy Yan | 2004-02-03 |
| 6680500 | Insulating cap layer and conductive cap layer for semiconductor devices with magnetic material layers | Kia-Seng Low, John P. Hummel, Igor Kasko | 2004-01-20 |