JW

Jiangtao Wang

NU Nikko Materials Usa: 2 patents #2 of 8Top 25%
GA Ga-Tek: 1 patents #1 of 3Top 35%
📍 Cleveland, OH: #6 of 72 inventorsTop 9%
🗺 Ohio: #291 of 5,375 inventorsTop 6%
Overall (2004): #26,980 of 270,089Top 10%
3
Patents 2004

Issued Patents 2004

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6824880 Process for improving adhesion of resistive foil to laminating materials Atnaf Admasu, Sidney J. Clouser 2004-11-30
6770976 Process for manufacturing copper foil on a metal carrier substrate Dan Lillie, David B. Russell, Sidney J. Clouser 2004-08-03
6771160 Resistor component with multiple layers of resistive material Michael A. Centanni, Sidney J. Clouser 2004-08-03