OS

Osamu Sugihara

HO Hoya: 1 patents #24 of 112Top 25%
Overall (2004): #143,271 of 270,089Top 55%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6713376 Method of manufacturing a contract element and a multi-layered wiring substrate, and wafer batch contact board 2004-03-30