YH

YI-MOU HUANG

AM Asia Pacific Microsystems: 1 patents #2 of 5Top 40%
Overall (2004): #84,049 of 270,089Top 35%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6784020 Package structure and method for making the same Chengkuo Lee 2004-08-31