Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787442 | Method of making a semiconductor having multi-layered electrodes including nickel and phosphorus and solder formed with tin and an alkaline earth metal | — | 2004-09-07 |
| 6780677 | Process for mounting electronic device and semiconductor device | Satoshi Imasu, Ikuo Yoshida, Akira Yamagiwa, Shinobu Takeura | 2004-08-24 |
| 6781234 | Semiconductor device having electrodes containing at least copper nickel phosphorous and tin | — | 2004-08-24 |
| 6767767 | Method of manufacturing a semiconductor device in which a block molding package utilizes air vents in a substrate | Norihiko Kasai | 2004-07-27 |
| 6737741 | Process for mounting electronic device and semiconductor device | Satoshi Imasu, Ikuo Yoshida, Akira Yamagiwa, Shinobu Takeura | 2004-05-18 |