NY

Nae Yoneda

HI Hitachi: 1 patents #1,316 of 3,771Top 35%
📍 Sakuragawa, JP: #2 of 10 inventorsTop 20%
Overall (2004): #147,125 of 270,089Top 55%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6686226 Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame Shigeharu Tsunoda, Junichi Saeki, Isamu Yoshida, Kazuya Ooji, Michiharu Honda +5 more 2004-02-03