Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774501 | Resin-sealed semiconductor device, and die bonding material and sealing material for use therein | Kazuhiko Kurafuchi, Naoya Suzuki, Masaaki Yasuda, Hiroyuki Sakai, Masao Kawasumi | 2004-08-10 |