Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6751855 | Process for forming an ultrafine copper alloy wire | Hakaru Matsui, Takaaki Ichikawa, Koichi Tamura, Osamu Seya, Ryohei Okada | 2004-06-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6751855 | Process for forming an ultrafine copper alloy wire | Hakaru Matsui, Takaaki Ichikawa, Koichi Tamura, Osamu Seya, Ryohei Okada | 2004-06-22 |