SB

Samson Berhane

HP HP: 1 patents #803 of 2,400Top 35%
📍 Corvallis, OR: #100 of 242 inventorsTop 45%
🗺 Oregon: #743 of 2,300 inventorsTop 35%
Overall (2004): #122,018 of 270,089Top 50%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6716737 Method of forming a through-substrate interconnect Hubert Vander Plas, Barry C. Snyder, Ronald A. Hellekson, Ronnie Yenchik, Diane Lai 2004-04-06