Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6756244 | Interconnect structure | — | 2004-06-29 |
| 6686642 | Multi-level integrated circuit for wide-gap substrate bonding | Michael J. Regan, Charles C. Haluzak | 2004-02-03 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6756244 | Interconnect structure | — | 2004-06-29 |
| 6686642 | Multi-level integrated circuit for wide-gap substrate bonding | Michael J. Regan, Charles C. Haluzak | 2004-02-03 |