JH

Jay F. Van Hoff

HP HP: 1 patents #803 of 2,400Top 35%
📍 Corvallis, OR: #100 of 242 inventorsTop 45%
🗺 Oregon: #743 of 2,300 inventorsTop 35%
Overall (2004): #198,358 of 270,089Top 75%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6727115 Back-side through-hole interconnection of a die to a substrate — 2004-04-27