Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6767477 | Etching process to selectively remove copper plating seed layer | Xue Hua Wu, Wensen Li, Si-Tuan Lam, Kochan Ju, Jei-Wei Chang | 2004-07-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6767477 | Etching process to selectively remove copper plating seed layer | Xue Hua Wu, Wensen Li, Si-Tuan Lam, Kochan Ju, Jei-Wei Chang | 2004-07-27 |