Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6788867 | Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication | Tony Mule, James D. Meindl, Paul A. Kohl, Stephen M. Schultz, Thomas K. Gaylord +3 more | 2004-09-07 |
| 6785458 | Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package | Tony Mule, Chirag S. Patel, James D. Meindl, Thomas K. Gaylord, Elias N. Glytsis +4 more | 2004-08-31 |
| 6690081 | Compliant wafer-level packaging devices and methods of fabrication | Hollie Reed, Paul A. Kohl, Chirag S. Patel, Kevin P. Martin, James D. Meindl | 2004-02-10 |