Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6786385 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masayuki Kitajima, Yoshitaka Muraoka | 2004-09-07 |
| 6744183 | Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method | Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii +4 more | 2004-06-01 |