Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777250 | Manufacture of wafer level semiconductor device with quality markings on the sealing resin | Shinsuke Nakajyo, Yoshiyuki Yoneda | 2004-08-17 |
| 6700198 | Resin for semiconductor wire | Hideki Toya, Mitsuyoshi Imai, Masaki Sakaguchi, Naoki Yamabe, Mamoru Suwa +2 more | 2004-03-02 |