Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6797626 | Method of polishing copper layer of substrate | Noriko MIYAIRI, Yasuo Inada, Tsuyoshi Hasegawa, Yuji Terashima, Kenji Sakai +1 more | 2004-09-28 |
| 6773476 | Polishing composition and polishing method employing it | Kenji Sakai, Kazusei Tamai, Tsuyoshi Matsuda, Katsuyoshi Ina | 2004-08-10 |