RH

Reiji Higuchi

FU Fujikura: 2 patents #10 of 119Top 9%
Overall (2004): #45,079 of 270,089Top 20%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6831236 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof Shouji Itou, Osamu Nakao 2004-12-14
6768064 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof Shouji Itou, Osamu Nakao 2004-07-27