Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815820 | Method for forming a semiconductor interconnect with multiple thickness | Kirk Strozewski, János Farkas, Hector Sanchez, Yeong-Jyh T. Lii | 2004-11-09 |
| 6764919 | Method for providing a dummy feature and structure thereof | Edward O. Travis, Bradley P. Smith | 2004-07-20 |