PE

Peter Elenius

FL Flip Chip Technologies, L.L.C.: 1 patents #1 of 2Top 50%
📍 Hopewell Junction, NY: #48 of 103 inventorsTop 50%
🗺 New York: #2,888 of 9,035 inventorsTop 35%
Overall (2004): #139,545 of 270,089Top 55%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6750135 Method for forming chip scale package Harry Hollack 2004-06-15