Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777800 | Semiconductor die package including drain clip | Ruben Madrid | 2004-08-17 |
| 6762067 | Method of packaging a plurality of devices utilizing a plurality of lead frames coupled together by rails | Gilmore S. Baje, Maria Christina B. Estacio, Marvin Gestole, Oliver M. Ledon, Santos E. Mepieza | 2004-07-13 |