Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6756689 | Power device having multi-chip package structure | O-seob Jun | 2004-06-29 |
| 6742561 | Apparatus for die bonding | Dong-Kuk Kim | 2004-06-01 |
SN
Shi-baek Nam
Fairchild Korea Semiconductor: 1 patents #3 of 18Top 20%
Overall (2004): #41,408 of 270,089Top 20%
2
Patents 2004