Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774465 | Semiconductor power package module | Ji Hwan Kim, Dae-Woong Chung, O-seob Jeon | 2004-08-10 |
| 6710439 | Three-dimensional power semiconductor module and method of manufacturing the same | Gi-Young Jeun, O-seob Jeon | 2004-03-23 |