Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815833 | Flip chip package | Gwo-Liang Weng, Wei-Chang Tai, Cheng-Yin Lee | 2004-11-09 |
| 6724075 | Semiconductor chip package and manufacturing method thereof | Chun-Chi Lee, Cheng-Yin Lee | 2004-04-20 |