Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6776893 | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect | Elena H. Too, Vincent Paneccasio, Jr., Richard Hurtubise | 2004-08-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6776893 | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect | Elena H. Too, Vincent Paneccasio, Jr., Richard Hurtubise | 2004-08-17 |