PI

Paul H. Townsend, III

Dow Global Technologies: 2 patents #16 of 265Top 7%
📍 Mesa, AZ: #17 of 194 inventorsTop 9%
🗺 Arizona: #256 of 2,283 inventorsTop 15%
Overall (2004): #46,622 of 270,089Top 20%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6815333 Tri-layer masking architecture for patterning dual damascene interconnects Lynne K. Mills, Joost Waeterloos, Richard J. Strittmatter 2004-11-09
6790792 Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers Edward O. Shaffer, II, Kevin E. Howard, James P. Godschalx 2004-09-14