Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6822018 | Thermally-conductive electrically-insulating polymer-base material | Arun K. Chaudhuri | 2004-11-23 |
| 6807731 | Method for forming an electronic assembly | Scott D. Brandenburg, Jeenhuei Tsai, Suresh K. Chengalva | 2004-10-26 |
| 6779260 | Overmolded electronic package including circuit-carrying substrate | Scott D. Brandenburg, Thomas A. Degenkolb | 2004-08-24 |
| 6703128 | Thermally-capacitive phase change encapsulant for electronic devices | Arun K. Chaudhuri, Jeffrey H. Burns | 2004-03-09 |
| 6693239 | Overmolded circuit board with underfilled surface-mount component and method therefor | Scott D. Brandenburg, Jeenhuei Tsai | 2004-02-17 |